Thermal Solution (Woodpecker, Robin)

In general, Robin and Woodpecker need a thermal solution. This may be:

• Fan blowing air directly on the module
• Heatspreader mounted on the module (The Heatspreader) is not designed for emitting heat to ambient)
• Heatspreader + suitable Heatsink for Heatspreader
• Heatsink (Robin) mounted on the module
• Fan blowing air to the mounted Heatspreader
• Fan blowing air to the mounted Heatsink (Robin)
• Heatspreader (Woodpecker, Robin) mounted on the module and connected thermally to the case
• Case connected thermally to the module

Exceptions can be:

• Woodpecker/Robin Z510 running in cold environment
• Woodpecker/Robin Z510 running in environment with high air flow

Woodpecker has the doubled PCB size than Robin, hence the thermal management on Woodpecker is less critical.